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Gold Plating, Immersion Silver 2 Layers Rigid and Flexible Lead Free HAL PCB TS16949:2002

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FASTPCBA Technology Co., Ltd.
City:beijing
Province/State:beijing
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Gold Plating, Immersion Silver 2 Layers Rigid and Flexible Lead Free HAL PCB TS16949:2002

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Place of Origin :China
Brand Name :FASTPCBA
Model Number :FASTPCBA-A486
Certification :UL
MOQ :10pcs
Packaging Details :ESD
Delivery Time :1 week
Payment Terms :T/T in advance
Supply Ability :20Kpcs/month for RF board
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Gold Plating, Immersion Silver 2 Layers Rigid and Flexible Lead Free HAL PCB TS16949:2002

(1) material:FR4 1.6mm

(2) Layer account:2 layers

(3) solder mask: green

(4) surface: Lead free HAL

(5) size: 85mm*125mm

(6) place of Original: China

(7) FASTPCBA

(8) model number: FASTPCBA-A486

(9) certification: UL

(10) MOQ: 10pcs

(11) Price:

(12) Packaging Details: ESD

(13) Delivery Time: 1 week

(14) Payment Terms: T/T in advance

(15) Supply Ability: 20Kpcs/month for RF board

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Reference- Our production capability for Rigid PCB:

1) layer: 1-22

2) Board finished thickness: 0.2mm-7.0mm

3) Material: FR-4, CEM-3, High TG, FR4 Halogen Free, Rogers.

4) Max. Finished board size: 580mm*900mm

5) Min hole size: 4mil(0.1mm)

6) Min trace width/space: 3.5mil/3.5mil

7) Surface finishing/treatment: HASL/Lead free HASL, Immersion Gold, Gold plating, Immersion silver, immersion Tin, OSP.

8) Copper thickness: 0.5oz to 6oz.

9) Solder mask color: Green/Yellow/Black/White/Red/Blue.

10) Copper thickness in hole: >18um

11) Inner packing: Vacuum packing/plastic bag

12) Outline tolerance:+/-0.13mm

Hole size tolerance: PTH+/-0.076mm NPTH:+/-0.05mm.

13) Quality ensure: UL approval, TS16949:2002

14) Special requirements: Buried and Blind vias, impedance control, via plug, BGA soldering, Gold finger.

15) Profiling: punching, Routing, V-cut, Beveling.

16) Provides OEM services to all sorts of printed circuit board assembly as well as Electronic encased products, and PCBA application from communication, medical, security and industrial control.

17) Assembly capacity:

Min soldering size: 0201

Capacity/day: 700, 000 points


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